TXRF (Total Reflection X-ray Fluorescence)

TXRF Applications

Ideal Uses of Total Reflection X-ray Fluorescence

• Metallic surface contamination on semiconductor wafers

TXRF Strengths

• Trace element analysis
• Survey analysis
• Quantitative
• Non-destructive
• Automated analysis
• Whole wafer analysis (up to 300 mm)
• Can analyze many substrates, e.g. Si, SiC, GaAs, InP, sapphire, glass

TXRF Technical Specifications

• Cannot detect low-Z elements (below Na on periodic chart)
• Polished surface required for best detection limits

TOF-SIMS Specifications

• Signal Detected: Fluorescent x-rays from wafer surface
• Elements Detected: Na-U
• Detection Limits: 109 – 1012 at/cm2
• Depth Resolution: 30 – 80 Å (Sampling Depth)
• Imaging/Mapping: Optional
• Lateral Resolution/Probe Size: ~10 mm